This high-performance 4-layer PCB is engineered using Rogers' RO4003C material—a woven glass reinforced hydrocarbon/ceramic laminate—to deliver exceptional electrical performance and manufacturability, making it ideal for high-frequency and RF applications. Below is a comprehensive overview of its specifications, construction, and key attributes:
PCB Construction Details
| Parameter | Details |
| Base Material | Rogers' RO4003C, a proprietary woven glass reinforced hydrocarbon/ceramic material combining PTFE/woven glass electrical performance with epoxy/glass manufacturability. |
| Layer Count | 4-layer rigid PCB, optimized for complex high-frequency signal routing and multi-layer functionality. |
| Board Dimensions | 60mm x 60mm per piece, with a tolerance of +/- 0.15mm for precise assembly fit. |
| Minimum Trace/Space | 4/5 mils, enabling fine signal routing critical for high-frequency operations. |
| Minimum Hole Size | 0.4mm, accommodating small components and ensuring reliable interconnections. |
| Finished Board Thickness | 4.8mm, providing robust structural integrity for demanding applications. |
| Finished Copper Weight | 1oz (1.4 mils) for both inner and outer layers, ensuring low resistance and efficient current handling. |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG), offering excellent corrosion resistance, solderability, and stable electrical contact. |
| Silkscreen | Black silkscreen on the top layer for clear component labeling; no silkscreen on the bottom layer. |
| Solder Mask | No solder mask on either top or bottom layers. |
| Special Features | Includes countersunk holes (conical, 90-degree) for secure mounting. |
| Quality Assurance | Undergoes 100% electrical testing prior to shipment, ensuring faultless performance and compliance with design specifications. |
PCB Stack-up
The 5-layer rigid PCB features a precise stack-up designed for optimal signal integrity and thermal stability:
| Layer | Specification |
| Copper Layer 1 | 35 μm, providing a solid conductive path for high-frequency signals. |
| Rogers 4003C Core | 0.508mm (20mil) thickness, forming the top insulating layer with stable dielectric properties. |
| Copper Layer 2 | 35 μm, facilitating intermediate signal routing. |
| Prepreg RO4450F (x2) | 0.204mm total thickness, ensuring reliable adhesion between layers. |
| Rogers 4003C Core | 1.524mm (60mil) thickness, serving as a central insulating layer. |
| Prepreg RO4450F (x2) | 0.204mm total thickness, maintaining layer bonding. |
| Rogers 4003C Core | 1.524mm (60mil) thickness, enhancing structural rigidity and insulation. |
| Prepreg RO4450F (x2) | 0.204mm total thickness, ensuring layer integrity. |
| Copper Layer 3 | 35 μm, supporting additional signal and power routing. |
| Rogers 4003C Core | 0.508mm (20mil) thickness, forming the bottom insulating layer. |
| Copper Layer 4 | 35 μm, mirroring the top layer for balanced electrical performance. |
Artwork and Standards
Artwork Supplied: Gerber RS-274-X, the industry-standard format for PCB manufacturing, ensuring compatibility with production processes.
Quality Standard: Manufactured to IPC-Class-2 specifications, guaranteeing high quality and reliability for general and high-frequency electronics.
RO4003C Material Overview
Rogers' RO4003C is a woven glass reinforced hydrocarbon/ceramic laminate that combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. It is available in configurations using 1080 and 1674 glass fabrics, all meeting the same electrical performance standards.
Unlike PTFE-based materials, RO4003C requires no special through-hole treatments or handling procedures, simplifying manufacturing. It is non-brominated and not UL 94 V-0 rated.
Key Features of RO4003C
Dielectric Constant: 3.38 +/-0.05 at 10GHz, ensuring consistent signal propagation.
Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz, minimizing signal loss across frequencies.
Thermal Coefficient of Dielectric Constant: +40 ppm/°C, maintaining stability over temperature ranges.
Thermal Conductivity: 0.71 W/m/°K, enabling efficient heat dissipation.
CTE: X-axis: 11ppm/°C, Y-axis: 14ppm/°C, Z-axis: 46ppm/°C, ensuring dimensional stability and compatibility with copper.
Moisture Absorption: 0.06%, maintaining performance in humid environments.
Tg: >280°C (536°F), ensuring stable expansion characteristics during processing.
Benefits of the PCB
Ideal for Multi-Layer Constructions: RO4003C’s properties support complex multi-layer board designs, critical for high-frequency applications.
Cost-Effective Manufacturing: Processes like FR-4 at a fraction of the cost of conventional microwave laminates, reducing production expenses.
High-Volume Compatibility: Designed for performance-sensitive, high-volume applications without compromising on quality.
Reliable Through-Holes: Low Z-axis CTE ensures reliable plated through-hole quality, even in severe thermal shock conditions.
Dimensional Stability: CTE similar to copper enhances stability, making it suitable for mixed dielectric multi-layer boards.
Typical Applications
This PCB is well-suited for:
-Cellular Base Station Antennas and Power Amplifiers
-RF Identification Tags
-Automotive Radar and Sensors
-Low-Noise Blocks (LNB's) for Direct Broadcast Satellites
Availability: This PCB is available for worldwide shipping, ensuring accessibility for global manufacturing and project requirements.
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Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications Images
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