This high-performance 2-layer rigid printed circuit board (PCB) is meticulously engineered using Rogers' TMM6 thermoset microwave material—a ceramic-thermoset polymer composite optimized for stripline and microstrip applications—to meet stringent electrical, thermal, and mechanical standards, making it ideal for a wide range of high-frequency RF, microwave, and communication systems.
PCB Specification
| Item | Specification |
| Base Material | TMM6 (Rogers thermoset microwave ceramic-polymer composite) |
| Layer Count | 2 layers |
| Board Dimensions | 40mm × 70mm per unit (1PCS), with a tolerance of ±0.15mm |
| Minimum Trace/Space | 4 mils (trace width) / 5 mils (trace spacing) |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.5mm |
| Finished Cu Weight (Outer Layers) | 1oz (equivalent to 1.4 mils or 35μm) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion silver |
| Silkscreen | No |
| Solder Mask | No |
| Electrical Test (Prior to Shipment) | 100% electrical test (covers continuity, insulation resistance, and short-circuit detection) |
Layer Stack-up
The 2-layer stack-up is precisely designed to maximize the performance advantages of Rogers TMM6 material, with clear layer functions and thicknesses:
| Layer Type | Material | Thickness |
| Top Conductive Layer | Copper_layer_1 | 35μm |
| Core Insulation Layer | Rogers TMM6 Thermoset | 0.381mm (15mil) |
| Bottom Conductive Layer | Copper_layer_2 | 35μm |
Artwork Format: Gerber RS-274-X, the industry-standard PCB fabrication format, ensuring compatibility and reducing fabrication errors.
Quality Standard: Complies with IPC-Class 2, meeting the reliability requirements of commercial and industrial high-frequency applications—ensures consistent performance under normal operating conditions and environmental variations.
Availability: Worldwide shipping.
Material Attributes of Rogers TMM6
As a ceramic-thermoset polymer composite tailored for microwave applications, Rogers TMM6 possesses unique properties that form the foundation of the PCB’s high performance:
1. Electrical Performance
Dielectric Constant (Dk): 6.0 ± 0.08 at 10GHz, with tight tolerance to ensure predictable signal propagation—critical for designing precise RF/microwave components such as filters and couplers.
Dissipation Factor (Df): 0.0023 at 10GHz, ultra-low loss to minimize signal attenuation—maintains signal integrity even in long trace routes, which is essential for high-frequency communication systems.
Thermal Coefficient of Dk: -11 ppm/°K, minimizing Dk drift caused by temperature changes—ensures stable performance in environments with fluctuating temperatures (such as outdoor communication equipment or satellite systems).
2. Thermal & Mechanical Resilience
Decomposition Temperature (Td): 425°C (TGA), withstanding high temperatures generated by power dissipation (e.g., in power amplifiers) and reflow soldering processes—prevents material degradation under extreme heat.
Coefficient of Thermal Expansion (CTE): 18 ppm/K (x-axis), 18 ppm/K (y-axis), 26 ppm/K (z-axis), matching the CTE of copper—avoids delamination between copper layers and TMM6 core during thermal cycling, enhancing structural stability.
Thermal Conductivity: 0.72 W/mK, efficiently dissipating heat from high-power components—reduces thermal hotspots and extends the service life of sensitive RF devices.
Mechanical Strength: Resists creep and cold flow, maintaining dimensional stability under mechanical stress—suitable for rugged applications such as automotive GPS antennas or aerospace communication modules.
3. Fabrication & Application Advantages
Process Compatibility: Compatible with all common PCB manufacturing processes (including etching, drilling, and plating), eliminating the need for specialized production techniques—reducing manufacturing costs and lowering technical barriers.
Chemical Resistance: Resistant to process chemicals (such as etchants and cleaning agents), minimizing material damage during fabrication and reducing reject rates.
Wire-Bonding Reliability: Based on thermoset resin, enabling stable wire bonding for RF chips—ensures reliable high-frequency signal transfer between chips and the PCB, which is critical for microwave circuit performance.
Some Typical Applications:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and coupler
- Satellite communication systems
- Global Positioning Systems Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers
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15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions Images
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