This high-performance 2-layer rigid PCB is crafted from TSM-DS3, a ceramic-filled reinforced material boasting an ultra-low fiberglass content of approximately 5%. Tailored for high-power, high-frequency, and thermally challenging applications, it capitalizes on TSM-DS3’s remarkable thermal conductivity, low dielectric loss, and dimensional stability.
PCB Specifications
| Parameter | Technical Details |
| Base Material | TSM-DS3 (ceramic-filled reinforced material, ~5% fiberglass content) |
| Layer Count | 2-layer rigid configuration |
| Board Dimensions | 68mm × 126mm ±0.15mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Vias | 51 total; no blind vias; 20μm plating thickness |
| Finished Board Thickness | 0.8mm |
| Finished Copper Weight | 1oz (35μm) for outer layers (top and bottom) |
| Surface Finish | Immersion Gold |
| Silkscreen | White on top layer; no silkscreen on bottom layer |
| Solder Mask | Green on top layer; no solder mask on bottom layer |
| Quality Assurance | 100% electrical testing (continuity, isolation) |
PCB Stack-up Configuration
The 2-layer stack-up is engineered to maximize TSM-DS3’s thermal and electrical performance, with a simplified structure tailored to high-power, high-frequency needs:
| Layer Sequence | Material/Component | Thickness |
| 1 | Copper Layer 1 (Top) | 35μm |
| 2 | TSM-DS3 Core | 0.762mm (30mil) |
| 3 | Copper Layer 2 (Bottom) | 35μm |
TSM-DS3 Material Overview
TSM-DS3 is a ceramic-filled reinforced material designed to bridge the gap between high-performance low-loss laminates and epoxy-based materials, with key distinguishing traits:
Composition: Ceramic fillers with ultra-low fiberglass content (~5%), enabling both low dielectric loss and dimensional stability that rivals epoxies.
Core Strengths: Thermally stable (TC=0.65 W/m·K) for high-power heat management, and low thermal expansion (matched to copper CTE) for demanding thermal cycling—critical for applications like oil drilling and semiconductor ATE testing.
Manufacturability: Compatible with standard PCB fabrication processes, supporting large-format, high-layer-count designs with the consistency and yield of fiberglass-reinforced epoxies, despite its low fiberglass content.
TSM-DS3 Key Features
TSM-DS3 delivers targeted performance features that define the PCB’s suitability for high-power, high-frequency applications:
- Precise Dielectric Constant: Dk=3.0±0.05 at 10GHz/23°C, ensuring minimal impedance variation across the board—essential for phased array antennas and couplers that require tight phase matching.
- Ultra-Low Dissipation Factor: 0.0014 at 10GHz, minimizing signal attenuation in high-frequency paths, preserving power efficiency in radar manifolds and mmWave antennas.
- High Thermal Conductivity: 0.65 W/MK (unclad), enabling efficient heat dissipation from high-power components (e.g., RF amplifiers) to prevent overheating and performance degradation.
- Low Moisture Absorption: 0.07%, preventing dielectric degradation and Dk drift in humid or harsh environments (e.g., oil drilling equipment, outdoor radar systems).
- Copper-Matched CTE: X-axis=10 ppm/°C, Y-axis=16 ppm/°C, Z-axis=23 ppm/°C, reducing thermal stress between copper layers and the substrate during thermal cycling—critical for long-term reliability in automotive and aerospace applications.
TSM-DS3 Material Benefits
The features of TSM-DS3 translate to tangible advantages for PCB design, manufacturing, and application performance:
- Low Fiberglass Content (~5%): Reduces dielectric discontinuities compared to traditional fiberglass-reinforced materials, improving high-frequency signal integrity.
- Epoxy-Rivaling Dimensional Stability: Enables large-format PCB fabrication (e.g., 68mm×126mm size of this PCB) without warpage, supporting complex component layouts.
- Large-Format, High-Layer-Count Compatibility: Facilitates scaling to multi-layer designs while maintaining yield and consistency—ideal for future iterations of high-power systems.
- Stable Dk Across Temperature: ±0.25% Dk variation from -30°C to 120°C, ensuring consistent performance in extreme operating environments (e.g., automotive mmWave radar, oil drilling electronics).
- Resistive Foil Compatibility: Supports integration of resistive foils for embedded passive components, simplifying design and reducing component count in compact systems.
Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with global manufacturing equipment.
Accepted Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial and industrial high-power/high-frequency applications with strict controls for trace accuracy, hole precision, and electrical continuity.
Processing Compatibility: TSM-DS3’s manufacturability (consistent with epoxy processes) eliminates the need for specialized equipment, reducing production costs and lead times.
Typical Applications:
- Couplers
- Phased Array Antennas
- Radar Manifolds
- mmWave Antenna/Automotive
- Oil Drilling
- Semiconductor/ATE Testing
Availability
This PCB is available for worldwide shipping, supporting global project requirements.
Conclusion
This 2-layer TSM-DS3 PCB combines the material’s unique ceramic-filled, low-fiberglass composition (low loss, high thermal conductivity) with precision manufacturing to address the demands of high-power, high-frequency applications.
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TSM-DS3 Rogers PCB Board 68mm × 126mm Size with 5/5 mils Trace/Space and 0.3mm Minimum Hole Size Images
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