This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
| Parameter | Details |
| Base Material | Rogers RO4003C Low Profile (LoPro) – Hydrocarbon ceramic laminate with reverse-treated foil |
| Layer Count | 2-Layer (rigid structure) |
| Board Dimensions | 64mm x 68.4mm per piece (1PCS) |
| Minimum Trace/Space | 5 mils (trace) / 5 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; via plating thickness = 20 μm |
| Finished Board Thickness | 0.65mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Silver underplating + Gold plating |
| Silkscreen | White silkscreen on top layer, no silkscreen on bottom layer |
| Solder Mask | Green solder mask on top layer; no solder mask on bottom layer |
| Quality Assurance | 100% electrical testing conducted prior to shipment |
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss—while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It’s designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
RO4003C Low Profile Key Features
| Feature | Specification |
| Material Composition | Hydrocarbon ceramic laminate with reverse-treated foil |
| Dielectric Constant (Dk) | 3.38 ± 0.05 at 10GHz/23°C |
| Dissipation Factor (DF) | 0.0027 at 10GHz/23°C |
| Thermal Performance | - Decomposition Temp (Td): >425°C- Glass Transition Temp (Tg): >280°C (TMA) |
| Thermal Conductivity | 0.64 W/mK |
| Coefficient of Thermal Expansion (CTE) | - X-axis: 11 ppm/°C- Y-axis: 14 ppm/°C- Z-axis: 46 ppm/°C (-55 to 288°C) |
| Process Compatibility | Lead-free process compatible; standard FR-4 fabrication compatible |
| Additional Attribute | CAF (Conductive Anodic Filament) resistant |
Material Benefits
RO4003C LoPro’s properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
CAF Resistance: Protects against conductive anodic filament formation.
Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
- Digital applications such as servers, routers, and high speed back planes
- Cellular base station antennas and power amplifiers
- LNB’s for direct broadcast satellites
- RF Identification Tags
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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided Images
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