RT/duroid® 5880 laminates, composed of glass microfiber reinforced PTFE composites, are engineered for high-precision stripline and microstrip circuits. Their randomly oriented microfibers ensure outstanding dielectric constant uniformity, which remains consistent across production panels and over a broad frequency spectrum.
With a low dissipation factor, RT/duroid 5880 performs reliably into Ku-band and higher frequencies. The material is easily cut, sheared, and machined, and resists common solvents and reagents used in circuit etching and plating.
Standard laminates are supplied with electrodeposited copper (½ to 2 oz/ft² or 8 to 70 µm) or reverse-treated EDC on both sides. Rolled copper foil cladding is available for more demanding electrical applications, and cladding with aluminum, copper, or brass plate can also be specified.
When ordering, please specify dielectric thickness, tolerance, copper foil type (rolled, electrodeposited, or reverse treated), and foil weight.
Features:
- Industry-lowest dielectric constant
- Low Z-axis coefficient of thermal expansion (CTE)
- Lightweight / low density
- Stable electrical properties across a wide frequency range
Typical Applications:
- Airborne antenna systems
- Lightweight feed networks
- Military radar systems
- Missile guidance systems
- Point-to-point digital radio antennas
| RT/duroid 5880 Typical Value |
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.20
2.20±0.02 spec. | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0004
0.0009 | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 |
| Specific Heat | 0.96(0.23) | N/A | j/g/k
(cal/g/c) | N/A | Calculated |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X |
| 860(125) | 380(55) | Y |
| Ultimate Stress | 29(4.2) | 20(2.9) | X |
| 27(3.9) | 18(2.6) | Y |
| Ultimate Strain | 6 | 7.2 | X | % |
| 4.9 | 5.8 | Y |
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y |
| 940(136) | 670(97) | Z |
| Ultimate Stress | 27(3.9) | 22(3.2) | X |
| 29(5.3) | 21(3.1) | Y |
| 52(7.5) | 43(6.3) | Z |
| Ultimate Strain | 8.5 | 8.4 | X | % |
| 7.7 | 7.8 | Y |
| 12.5 | 17.6 | Z |
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 |
| Coefficient of Thermal Expansion | 31
48
237 | X
Y
Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil
after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
